%ما هو (من)٪ 1 - تعريف
TYPE OF INTEGRATED CIRCUIT PACKAGING. IN A PGA, THE PACKAGE IS SQUARE OR RECTANGULAR, AND THE PINS ARE ARRANGED IN A REGULAR ARRAY ON THE UNDERSIDE OF THE PACKAGE
SPGA; PPGA; FCPGA; Staggered pin grid array; Flip-chip pin grid array; Ceramic pin grid array; Plastic grid array; FC-PGA; Ceramic Pin Grid Array; Organic pin grid array; Opga; Organic Pin Grid Array; Pin Grid Array; Pin grid; OPGA; Stud grid array; Stud Grid Array; Polymer Stud Grid Array; Plastic Stud Grid Array; Staggered Pin Grid Array
 CPU-pins PNr°0295.jpg?width=200 "Closeup of the pins of a pin grid array")
![AM2+ socket]]](https://commons.wikimedia.org/wiki/Special:FilePath/AMD Phenom X4 9750 (Underside).JPG?width=200 "AM2+ socket]]")
![Underside of a [[Pentium 4]] in a PGA package](https://commons.wikimedia.org/wiki/Special:FilePath/Pentium 4 Underside Demonstrating PGA Socket.JPG?width=200 "Underside of a [[Pentium 4]] in a PGA package")
![The topside of a [[Celeron]]-400 in a PPGA packing](https://commons.wikimedia.org/wiki/Special:FilePath/UpSL3A2.JPG?width=200 "The topside of a [[Celeron]]-400 in a PPGA packing")
![A 1.2 GHz [[VIA C3]] microprocessor in a ceramic package](https://commons.wikimedia.org/wiki/Special:FilePath/VIA C3 C5XL CPGA.jpg?width=200 "A 1.2 GHz [[VIA C3]] microprocessor in a ceramic package")
![The underside of a [[Celeron]]-400 in a PPGA](https://commons.wikimedia.org/wiki/Special:FilePath/SL3A2down.JPG?width=200 "The underside of a [[Celeron]]-400 in a PPGA")
PPGA
Plastic Pin Grid Array (Reference: CPU)
ويكيبيديا
Pin grid array
A pin grid array (PGA) is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are arranged in a regular array on the underside of the package. The pins are commonly spaced 2.54 mm (0.1") apart, and may or may not cover the entire underside of the package.
PGAs are often mounted on printed circuit boards using the through hole method or inserted into a socket. PGAs allow for more pins per integrated circuit than older packages, such as dual in-line package (DIP).
